INVENS ROYAL R6 FLASH FILE FIRMWARE SPD OFFICIAL PAC LOGO HANG LCD FIX TESTED ROM BY FOYSAL TELECOM
INVENS ROYAL R6 UPDATE FIRMWARE
INVENS ROYAL R6 STOCK ROM OFFICIAL PAC
INVENS ROYAL R6 NO NEED BOX OR DONGEL FLASH ONLY TOOLS
INVENS ROYAL R6 HANG ON LOGO FIXED UPDATE
INVENS ROYAL R6 BLACK LCD SOLVED FLASH FILE
INVENS ROYAL R6 NO DEAD RICK OFFICIAL PAC
INVENS ROYAL R6 FRP LOCK REMOVE FIRMWARE
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| Build number - Royal R6_MJL_XP_Android_6.0_V01_20180508 |
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| T13_BOPAI_BOE_BATTERY_64_4_t13_bopai_RS01_invens_mjl_64_4_5.1_invens-Royal_R6_BOE_Android_5.1_V09_20171102_Royal_R6 |
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| Boot Ver : SC7731 Crev eMMC Loader v2.0 Sending FLASH FDL FLASH FDL Ready! Boot Ok! Model Name : t13_bopai_RS01_invens_mjl_64_4_dt Model Brand : invens Model Device: t13_bopai_RS01_invens_mjl_64_4 AndrVersion : 5.1 BaseBand CPU: T13_BOPAI_BOE_BATTERY_64_4 Project Ver : invens-Royal R6_BOE_Android_5.1_V09_20171102 Model Ext : Royal R6 [Read Mode] : HSUSB : 0x3000 [FW_READER] : Reading Firmware Now ... [Read Ok] : u-boot-spl-16k.bin [Read Ok] : u-boot.bin [Read Ok] : prodnv.img [Read Ok] : sc7731C_CP0_modem.bin [Read Ok] : DSP_DM_Gx.bin [Read Ok] : nvitem_w.bin [Read Ok] : sc8830g_modem_CP2_WCN_Trunk_W17.07.3_Release.bin [Read Ok] : nvitem_wcn.bin [Read Ok] : logo_480x854.bin [Read Ok] : fblogo_480x854.bin [Read Ok] : thirdlogo.bin [Read Ok] : forthlogo.bin [Read Ok] : fifthlogo.bin [Read Ok] : boot.img [Read Ok] : system.img [Read Ok] : oem.img [Read Ok] : sysinfo.img [Build Ok] : cache.img [Read Ok] : recovery.img [Build Ok] : userdata.img AndroidInfo created Firmware Size : 2326 MiB Saved to : C:\Users\Foysal Telecom\Desktop\T13_BOPAI_BOE_BATTERY_64_4_t13_bopai_RS01_invens_mjl_64_4_5.1_invens-Royal_R6_BOE_Android_5.1_V09_20171102_Royal_R6\ Done! Elapsed: 00:06:19 Reconnect Power/Cable! |
INVENS ROYAL R6 FLASH FILE FIRMWARE SPD OFFICIAL PAC LOGO HANG LCD FIX TESTED ROM BY FOYSAL TELECOM
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Reviewed by http://www.foysalgsm.com/
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